Organizing Committee
| General Co-chairs | Shie-Yuan Wang | National Chiao Tung University, Taiwan |
| Javier Gozalvez | University Miguel Hernandez, Spain | |
| Technical Program Co-chairs | Jérôme Härri | Karlsruhe Institute of Technology, Germany |
| Daniel Jiang | Mercedes-Benz Research & Development North America, Inc., USA | |
| Finance Chair | James Irvine | University of Strathclyde, UK |
| Demos Chair | Giovanni Pau | University of California, Los Angeles, USA |
| Speakers Chair | Wai Chen | Telcordia Technologies, USA |
Technical Program Committee
Subir Biswas, Michigan State University, USA
Carlos Jesús Bernardos Cano, Universidad Carlos III de Madrid (UC3M)
Miro Bogdanovic, Daimler AG, Germany
Qi Chen, Mercedes-Benz Research & Development North America, USA
Wai Chen, Telcordia Technologies, USA
Yuh-Shyan Chen, National Taipei University, Taiwan
Tsun-Chieh Chiang, Industrial Technology Research Institute, Taiwan
Carla Fabiana Chiasserini, Politecnico di Torino, Italy
Andreas Festag, NEC Europe, Germany
Marco Fiore, INSA Lyon, France
Márco Gruteser, Rutgers University, USA
Hannes Hartenstein, University of Karlsruhe, Germany
Teruo Higashino, Osaka University, Japan
Bor-Shenn Jeng, Yuan Ze University, Taiwan
Frank Kargl, University of Ulm, Germany
John Kenney, Toyota ITC, USA
Hariharan Krishnan, General Motors (GM), USA
Kun-chan Lan, National Cheng Kung University, Taiwan
Tim Leimüller, Denso Automotive, Germany
Massimiliano Lenardi, Hitachi Europe, France
David Matolak, Ohio University, USA
HyunSeo Oh, Electronics and Telecommunication Research Institute, Korea
Panos Papadimitratos, EPFL, Switzerland
Dirk Pesch, Cork Institute of Technology, Ireland
Giuseppe Raffa, Intel Corp, USA
Vinuth Rai, Toyota ITC, USA
Matthias Roeckl, DLR, Germany
Paolo Santi, CNR, Italy
Elmar Schoch, Ulm University, Germany
Sidi Mohamed Senouci, France Telecom, France
Miguel Sepulcre, University Miguel Hernandez of Elche, Spain
Dan Stancil, Carnegie Mellon University, USA
Markus Strassberger, BMW Research and Technology
Tomotaka Wada, Kansai University, Japan
Weidong Xiang, University of Michigan, USA
Yasushi Yamao, University of Electro-Communications (UEC Tokyo), Japan
Tao Zhang, Telcordia, USA
Thomas Zwick, Karlsruhe Institute of Technology, Germany